ENCAPSULANT

UV LIGHT CURABLE ENCAPSULANTS FOR MICROELECTRONIC ASSEMBLY AND IC PROTECTION

Incure Encap^TM UV encapsulants are ideal for applications such as Bare Die Encapsulation, Chip-On-Board, Chip-On-Flex Encapsulation, Chip-On-Glass, Flex Circuit Bonding / Attachment, Multi-Chip Modules, Wire Bonding etc. These one part, no-mix products cure in seconds for immediate inspection in high assembly operations. Excellent proctection on flexible and rigid platforms.

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Advantages of Encap^TM - UV Encapsulants		Learn about our Light Curing Systems:
	Superior Adhesion to PET & Polyimide	C9000 / U8000 UV Light Curing Conveyor Systems
	Low Stress Under Thermal Cycling	F500 Portable UV Curing Lamp
	Room Storage
	Thermal Shock and Moisture Resistant

Encap^TM Series Core Products
Product	Product Highlights	Substrates	Color	Viscosity	Tensile (psi)	Hardness	Elongation
3522	Low viscosity encapsulant. Clear, hard, sleek and resilient protective coating thickness of 300 to 4,500 microns on components. Very low water absorption.	Low Adhesion	Clear	20 cP	150	D84 – D94	4%
3555	Ultra-low stress, clear electronic component encapsulant. Fast curing with good light transmission properties. Enhanced moisture and temperature resistance. Does not attack the flexible circuit easily.	Multi-Substrates (Low Adhesion)	Clear	20 cP	4,150	D63 – D73	32%
Package Size: 10 ml syringe / 30 ml syringe / 30 ml squeeze bottle / 100 ml squeeze bottle / 250 ml squeeze bottle / 1 kg Bottle / 1 Gallon Pail / 2 Gallon Pail / 5 Gallon Pail