Nineteen adhesives can all carry a “3000°F” rating on the datasheet and still be wrong for each other’s job — one has to stay chemically inert against a platinum sensor it’s bonding, another has to match mica’s exact thermal expansion rate, and a third just needs to stop a bolt from vibrating loose inside a kiln. Incure’s Epo-Weld™ high temperature bonding line spans that range across nineteen single- and two-part ceramic adhesives, and choosing the right one starts with function, not the shared temperature number on the label.
One Mechanical Profile, Nineteen Different Ceramic Chemistries
Most of the line shares the same physical form — a thixotropic ceramic paste — and the same three-stage cure schedule of 1 to 4 hours at room temperature, 2 hours at 200°F, and 2 hours at 500°F, with flexural strength in the 1,100–2,200 PSI range and tensile shear of just 250–600 PSI. Those are modest numbers next to Incure’s structural epoxy lines, because these grades aren’t chosen for load-bearing strength — they’re chosen for chemical inertness, dielectric strength, or a base ceramic that expands and contracts at the same rate as the substrate it’s bonded to. The real selection variable across nineteen otherwise similar-looking pastes is which of nine base ceramic fillers — alumina, alumina-silica, aluminum nitride, magnesium oxide, mica, silica, silicon carbide, zirconia, or zirconium silicate — actually matches the application’s electrical, thermal, or chemical requirement.
Lamp and Lighting Assembly
HTB-8012, HTB-8017, and HTB-8058 all bond halogen and HID lamp components, but split by production need. HTB-8012 is a fast-setting, single-part alumina adhesive built for high-speed capping of quartz lamps and ceramic bases. HTB-8017 is the two-part version of the same chemistry, trading single-part convenience for higher mechanical strength and vibration resistance on large halogen and HID lights, curing deep sections without trapping volatiles. HTB-8058 is the standard-duty, cost-effective option for high-speed lamp manufacturing where neither 8012’s faster set nor 8017’s added strength is actually required.
Sensor, Thermocouple, and Instrumentation Bonding
HTB-8007, HTB-8026, HTB-8035, and HTB-8053 all bond sensing elements, but each solves a different failure mode. HTB-8007 is moisture-resistant and hydrophobic, formulated for gas chromatograph and mass spectrometer sensor assembly where dielectric strength prevents signal drift. HTB-8026 is inert and non-contaminating up to 2500°F, specifically for automotive oxygen sensors and gas heaters where the bond can’t interfere with the sensing element itself. HTB-8035 adds aluminum nitride filler for genuine thermal conductivity on top of dielectric strength, so heat reaches a potted thermocouple or probe quickly rather than lagging the way an insulating cement would. HTB-8053 is zirconia-based and chemically resistant to molten metals and oxidizing atmospheres, built for potting platinum sensors up to 3200°F in the same harsh process environment the sensor is measuring.
Email Us with your substrate, service temperature, and whether the bond needs to stay chemically inert or electrically isolating, and Incure’s engineers can confirm which Epo-Weld™ high temperature bonding grade actually fits.
Refractory Repair, Insulation, and Sealing
HTB-8021 repairs furnace linings and refractory brick with thermal-shock resistance against acidic flue gas and molten metal exposure, replacing patching mixes that spall under repeated cycling. HTB-8008 bonds and impregnates ceramic textiles — fabric, tape, sleeving — to metal or ceramic, used for insulating exhaust pipes and securing thermocouple insulation. HTB-8040 bonds refractory insulation and graphite felt for furnace lining, but tops out at just 1400°F — the lowest service ceiling in the entire line, worth checking before assuming every “high temperature” grade shares the same headline rating. HTB-8057 is a zirconium silicate sealant that forms a hard, gas-tight barrier on infrared heaters and exhaust manifolds.
One Genuine Extreme-Temperature Outlier, and a Handful of Specialty Grades
HTB-8039 stands apart from the rest of the line entirely: a graphite-based adhesive rated to 5400°F — nearly double the ceiling of every other grade — formulated exclusively for reducing, inert, or vacuum atmospheres since graphite itself oxidizes in open air. It’s also the only grade supplied as a flowable 400–600 cP liquid rather than a paste, curing in a single 2-hour step at 200°F instead of the line’s usual three-stage ramp, built for bonding graphite trays, dies, and susceptors in furnace fixturing. The remaining grades each serve a narrower niche: HTB-8005 is a high-purity, non-outgassing alumina adhesive for vacuum and semiconductor electronics bonding; HTB-8044 is a two-part magnesium oxide adhesive that electrically isolates copper induction coils while still conducting heat; HTB-8048 is mica-based, matched specifically to mica and glass’s own thermal expansion rate; HTB-8049 is a low-expansion silica adhesive for bonding porous ceramic filters and quartz vessels; HTB-8050 uses silicon carbide filler for abrasion-resistant bonding of SiC components and furnace furniture; and HTB-8062 is zirconia-based, matched to the thermal expansion of zirconia electrolytes for solid oxide fuel cell stack assembly.
Where the Line Fits
Lighting manufacturers standardize on the 8012/8017/8058 alumina trio by production volume and strength requirement rather than treating them as interchangeable. Instrumentation and process-control assemblies draw on the sensor-bonding group for inert, dielectric, or thermally conductive potting depending on what the sensor itself needs. Furnace and refractory maintenance programs pull from the insulation and sealing group, the same weld-replacement logic covered for metal components in Incure’s high strength structural epoxy line but applied here to ceramic and refractory substrates instead. Facilities running Incure’s high-temperature epoxy line up to 2600°F or the ultra high temperature epoxy line up to 572°F (300°C) can step up to this ceramic-adhesive line specifically where the substrate is ceramic, graphite, or refractory rather than metal or composite, or where the service temperature exceeds what an organic epoxy resin can survive at all.
Contact Our Team to confirm the Epo-Weld™ high temperature bonding grade for your substrate and application.
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