In the world of electronics, automotive, and industrial machinery, products are rarely static. They are subject to a constant barrage of environmental stress, from the freezing cold of winter to the intense heat of operation. This repeated thermal cycling—the expansion and contraction of materials—is a silent, destructive force that can cause even the most secure bond to fail over time, leading to component delamination, product malfunctions, and costly warranty claims.

You shouldn’t have to risk your product’s reputation on a bond that can’t handle the heat.

The Uncompromising Solution for Thermal Stress

Incure GapFill™ D98 is a specialized adhesive designed to solve this exact problem. It is the professional’s choice for applications where long-term reliability in the face of thermal stress is non-negotiable. It provides a bond that is not just strong, but flexible enough to maintain its integrity through repeated temperature fluctuations.

A Bond That Won’t Break Under Pressure

The core of D98’s value is its thermal cycling resistant formula. While standard adhesives become brittle under cold and soft under heat, D98 is engineered to withstand this constant stress, preventing the microscopic cracks and failures that lead to delamination. This directly translates to a longer product lifespan and a higher degree of reliability in real-world conditions.

Fast and Strong

Despite its advanced properties, D98 provides a high shear strength of 3,000 psi and a fast fixture time of just 50 seconds. This allows you to achieve a quick and powerful bond without compromising on the long-term durability your product demands. Its clear finish also ensures a professional, clean appearance for applications where aesthetics are critical.

Don’t wait for your product to fail in the field. Discover the Incure GapFill™ D98 difference and build a bond that endures.