In the real world, products rarely face just one threat. The electronics in your car, the sensors on a factory floor, and the components in outdoor equipment are subjected to a brutal combination of forces: rapid temperature changes and constant exposure to moisture. While some adhesives are designed to resist one of these threats, the synergistic effect of heat and humidity can lead to premature bond failure, delamination, and costly product malfunctions.

You shouldn’t have to build your products for a laboratory. You need a solution designed for the harsh reality of their environment.

The Uncompromising Solution for Dual Threats

Incure GapFill™ D99 is a specialized adhesive engineered to solve this exact problem. It is the professional’s choice for applications where long-term reliability in the face of both thermal cycling and humidity is non-negotiable. It provides a bond that is not just strong, but uniquely formulated to withstand the dual-threat environments that cause other adhesives to fail.

A Bond That Defies Its Environment

The core of D99’s value is its dual resistance to both thermal cycling and humidity. This unique formulation ensures the bond maintains its integrity through repeated temperature fluctuations and in high-moisture environments. It can withstand continuous temperatures up to 100°C and intermittent temperatures up to 120°C, making it a reliable choice for high-heat applications.

Versatility and Durability

D99’s medium viscosity allows it to fill gaps up to 0.25 mm, ensuring a robust, reliable bond even on imperfect surfaces. Its versatility to bond to a variety of materials—including most metals, plastics, and rubbers—makes it a single, powerful solution for complex assemblies.

Don’t wait for your product to fail in the field. Discover the Incure GapFill™ D99 difference and build a bond that defies its environment.