Bonding glass to metal is one of the harder jobs in adhesives. The two materials expand at very different rates, glass is brittle in tension, and the joint often has to seal as well as hold. Incure Epo-Weld™ HTE-6418 is a fast-setting two-part epoxy built for this combination. Why glass-to-metal bonding is difficult When glass and metal are joined and the assembly changes temperature, the metal moves much more than the glass. That difference shows up as shear stress at the bond line and as tension in the glass near the joint edge. Push it far enough and the glass cracks or the bond peels. A successful glass-to-metal adhesive has to combine real strength with enough toughness to absorb that movement, and it has to wet both a high-energy metal surface and a smooth glass surface. This is the same mechanism described in the guide to how CTE mismatch causes adhesive bond failure. What HTE-6418 offers Epo-Weld™ HTE-6418 is a two-component epoxy formulated for rapid handling. It has a pot life of about 3 minutes and begins developing meaningful strength within roughly 15 minutes, so parts can move down the line quickly instead of sitting in fixtures. It bonds, seals, and fills in one operation, resists elevated temperatures and a range of chemicals, cures to a high-gloss finish, and is RoHS compliant. The fast set is the main trade-off to plan around: you have a short working window, so mix small batches and have parts prepared and positioned before you dispense. Key properties and what they mean Short pot life, fast strength gain. Good for high-throughput assembly and for repairs where you cannot clamp a part for hours. Not suited to large bond areas that take time to position. Bonding and sealing in one. The cured epoxy fills the joint and seals against moisture and contamination, so a separate gasket or sealant is often unnecessary. Temperature and chemical resistance. The joint holds up in warm, chemically active environments where a general-purpose epoxy would soften. High-gloss finish. Useful where the bond line is visible on a finished product. Where HTE-6418 fits Electronics and instrumentation: sealing glass windows, lenses, and sight glasses into metal housings. Lighting: bonding glass optics and covers to metal fixtures. Automotive and transportation: attaching glass elements and sensors to metal brackets. Industrial equipment: sealing gauge glasses and viewing ports on tanks and process equipment. Appliance and consumer products: bonding glass panels to metal frames on a moving assembly line. Joint design and surface preparation Keep the bond line thin and even, ideally 0.1 to 0.25 mm, and design the joint so the adhesive is loaded in shear or compression rather than peel or cleavage. On the metal, degrease with a clean solvent, abrade to fresh material, and wipe again before bonding. On the glass, a clean solvent wipe is usually enough; a light abrasion or a primer improves durability where the joint will see moisture. Bond within a few hours of preparation. If you are sealing a window…

Not every thermal management problem needs an exotic material. A large share of them are solved by an aluminum-filled epoxy that bonds to almost anything, resists chemicals, and holds properties from deep cold to 200°C. That is what Incure Epo-Weld™ TC-9033 is built to be. What TC-9033 is Epo-Weld™ TC-9033 is a two-part, aluminum-filled thermally conductive epoxy for bonding and potting. The metal filler raises the thermal conductivity of the cured matrix so heat moves across the joint instead of stalling at an insulating bond line. Its strength is breadth: it bonds well to metals, ceramics, and many plastics, resists a wide range of chemicals, and works across roughly -65°C to 205°C (-85°F to 400°F). TC-9033 is thermally conductive but is not an electrical insulator. Where a joint must also isolate the component from the substrate, use the aluminum-nitride-filled TC-9051. Key properties and what they mean Broad substrate compatibility. One qualified adhesive covers metal-to-metal, metal-to-ceramic, and metal-to-plastic joints, which reduces the number of materials a shop has to stock and validate. Thermal conductivity across the bond line. A thin, void-free layer of TC-9033 lowers the thermal resistance between a component and its heat sink far below what an air gap or a plain adhesive allows. Chemical resistance. The cured matrix resists solvents, coolants, fuels, and dilute acids and bases over long exposure. Wide temperature range. Properties hold from cold-soak startup to a 205°C operating ceiling, covering most electronics and industrial equipment. Where TC-9033 fits Electronics and semiconductor equipment: bonding heat sinks, spreaders, and components to substrates. LED lighting: attaching LED boards and modules where heat must leave the junction efficiently. Power electronics: thermal management for drives, supplies, and controllers. Automotive and aerospace: heat-coupling sensors and control modules exposed to vibration and thermal cycling. Industrial equipment: bonding and potting components in machinery operating in warm, contaminated environments. Building a low-resistance thermal joint The thermal performance of the joint is set by three things you control: the conductivity of the adhesive, the contact area, and the bond line thickness. Since you cannot change the first without changing the product, focus on the other two. Use enough adhesive to wet both surfaces fully and fill the gap, but no more; a thick layer adds resistance. Apply in a pattern that pushes air out as the parts mate, so the finished joint is void-free. Make sure the mating faces are flat and clean, so the whole area carries heat rather than a few high spots. Account for thermal expansion differences between the component and the substrate. A rigid joint between dissimilar materials is loaded every thermal cycle, a mechanism explained in how CTE mismatch causes adhesive bond failure. For help sizing a bonded thermal interface, Email Us with the component footprint, power dissipation, and sink details. Surface preparation, mixing, and cure Degrease all substrates, abrade metals to fresh material, then wipe clean and let dry. On plastics, confirm the specific polymer is compatible and clean without leaving a residue. Meter the two parts at…

Bonding a power semiconductor to a grounded heat sink asks two things of the adhesive at once: pull heat out of the device, and keep it electrically isolated from the sink. Most metal-filled thermal epoxies fail the second test. Incure Epo-Weld™ TC-9051 is formulated to pass both. What TC-9051 is Epo-Weld™ TC-9051 is a two-part thermally conductive epoxy filled with aluminum nitride rather than a metal powder. Aluminum nitride has high thermal conductivity but is an electrical insulator, so the cured adhesive conducts heat across the joint while maintaining dielectric separation between the component and the substrate. That combination is what makes TC-9051 suited to power electronics, where a metal-filled epoxy would short the device to the chassis. Its service range runs from roughly -65°C to 205°C (-85°F to 400°F), covering cold-soak startup and sustained operating temperature in most power-conversion hardware. Key properties and why they matter Thermally conductive and electrically insulating. You get a low-thermal-resistance path and a dielectric barrier from a single material, removing the need for a separate insulating pad or film with its own contact resistances. Wide temperature range. The adhesive holds properties from deep cold to 205°C, matching the operating envelope of most drives, converters, and LED modules. Strong structural bond. Unlike a thermal grease or a clip-held pad, TC-9051 mechanically fixes the component, which improves vibration resistance and simplifies assembly. Environmental protection. As a potting compound it also shields the encapsulated electronics from moisture and contamination. Where TC-9051 fits Power electronics: bonding IGBTs, MOSFETs, rectifiers, and power modules to heat sinks and cold plates while keeping them isolated. LED lighting and displays: attaching LED arrays and drivers so heat leaves the junction without a separate insulator. Automotive and aerospace: thermal management for onboard power conversion exposed to vibration and thermal cycling. Renewable energy: bonding and potting inverter and charge-controller electronics in solar and wind systems. Industrial motor drives: heat-coupling and isolating switching devices in variable-frequency drives. Designing the isolated thermal joint Control the bond line. Thermal resistance rises with thickness, but so does dielectric strength. There is an optimum: thick enough to guarantee isolation with no filler particles bridging the gap, thin enough to keep thermal resistance low. The datasheet gives a recommended range. Keep it void-free. A void is both a hot spot and a weak point in the dielectric. Apply the adhesive so air is pushed out as the parts close. Manage expansion mismatch. A rigid joint between a semiconductor and a metal sink is stressed on every power cycle. Reducing bond area and controlling the gap spreads that load; the mechanism is covered in how CTE mismatch causes adhesive bond failure. If you need to confirm that a given bond line will hold off your working voltage, Email Us with the voltage, the gap, and the substrates. Surface preparation, mixing, and cure Degrease and lightly abrade metal surfaces, then wipe clean and dry. Meter the two components accurately and mix until completely uniform; the ceramic filler hides streaking, so extend the…

A heat sink only works if heat can actually reach it. An air gap or a low-conductivity adhesive at the interface throttles the whole thermal path. Incure Epo-Weld™ TC-9042 is a two-part epoxy that moves heat across the joint while surviving temperatures that defeat most thermal adhesives. What TC-9042 is Epo-Weld™ TC-9042 is an aluminum-filled, two-component thermally conductive epoxy for bonding and potting. The metal filler raises the bulk thermal conductivity of the cured matrix so the adhesive conducts heat from a component into a sink or chassis instead of insulating it. Its service range extends to roughly -60°C to 300°C (-76°F to 572°F), which is wider than typical thermal epoxies and lets it work in exhaust-adjacent, downhole, and furnace-adjacent locations. TC-9042 is thermally conductive but is not formulated as an electrical insulator; where a component must be both heat-coupled and electrically isolated, use the aluminum-nitride-filled TC-9051 instead. Key properties and why they matter Thermal conductivity across the bond line. The relevant figure is the conductivity of the adhesive multiplied by the contact area and divided by the bond line thickness. A thinner, void-free joint of conductive epoxy dramatically lowers thermal resistance. Wide temperature range. Holding properties to about 300°C means TC-9042 does not become the weak link in equipment that already runs hot. Chemical resistance. The cured matrix resists solvents, fuels, and dilute acids and bases. Bonding and potting in one product. You can attach a heat sink and encapsulate the surrounding electronics with the same qualified material. Where TC-9042 fits Aerospace and defense: bonding heat sinks and cold plates on avionics that see wide thermal swings. Automotive and transportation: attaching power electronics and sensors in engine-bay and exhaust-adjacent locations. Industrial power conversion: potting and bonding rectifiers, drives, and controllers that dissipate significant heat. Oil and gas: thermal management for downhole and surface electronics exposed to high ambient temperatures. Furnace and oven instrumentation: bonding sensor packages that must shed self-heating while sitting in a hot enclosure. Getting the thermal path right Keep the bond line thin. Thermal resistance is proportional to thickness. Use just enough adhesive to fill the gap and wet both surfaces; excess adhesive squeezed into a thick layer defeats the purpose. Eliminate voids. An air pocket is a local hot spot. Apply the adhesive in a pattern that pushes air out as the parts close, rather than trapping it in the center. Flatten and clean the mating faces. High points carry all the load and leave the rest of the interface starved. Plan for expansion. A rigid conductive joint between a silicon device and a metal sink is loaded every thermal cycle. This guide to how CTE mismatch causes adhesive bond failure explains how to manage that stress. If you want help estimating the thermal resistance of a proposed joint, Email Us with the die size, power dissipation, and sink details. Surface preparation, mixing, and cure Degrease and abrade metal surfaces, then wipe clean and dry. Meter the two parts at the specified ratio and mix…