Low Shrinkage Adhesives: Incure Uni-Seal™ 3718F

  • Post last modified:September 7, 2024

Protecting your delicate electronic components on printed circuit boards (PCBs) is crucial for optimal performance and longevity. Look no further than Incure Uni-Seal™ 3718F, a high-performance encapsulant that offers exceptional protection, durability, and ease of inspection.

Key Benefits of Incure Uni-Seal™ 3718F:

  • Fast Curing: Cures in seconds with UV/visible light or LED, minimizing production time.
  • Optional Secondary Heat Cure: Provides added flexibility for deeper cures.
  • Low Stress and Shrinkage: Ensures minimal component distortion during the curing process.
  • Superior Moisture Barrier: Protects sensitive components from moisture damage.
  • Enhanced Durability: Exhibits excellent moisture and temperature resistance for long-lasting protection.
  • Fluorescing Feature: Simplifies inspection for optimal application and quality control.
  • Environmentally Friendly: Formulated with 100% solids and no volatile organic compounds (VOCs).
  • Thermal Cycling Ready: Ideal for products that undergo frequent temperature fluctuations.

Ideal Applications for Incure Uni-Seal™ 3718F:

  • Electronics: Encapsulating electronic components on PCBs in various applications.
  • Automotive Electronics: Protecting components in harsh automotive environments.
  • Medical Devices: Encapsulating components in medical equipment for enhanced reliability.
  • Industrial Electronics: Safeguarding components in industrial control systems and devices.

Conclusion:

Incure Uni-Seal™ 3718F is a powerful and versatile encapsulant that can elevate your PCB manufacturing processes. Its exceptional protection, durability, fast curing, and ease of inspection make it an ideal choice for a wide range of applications.

Searching for Best Low Shrinkage Adhesives? Our wide selection offers the perfect solution for your needs. Shop now/Browse or visit www.incurelab.com for more products available.