In the demanding world of industrial electronics and sensitive equipment, maintaining electromagnetic interference (EMI) and radio-frequency interference (RFI) shielding integrity is non-negotiable. The reliability of critical systems often hinges on the quality of the bond that holds these shielding materials in place. For design engineers and manufacturing specialists, finding an adhesive that delivers not only a robust mechanical connection but also enduring environmental resistance is a constant challenge.
This is where ultra-high bond epoxy technology steps in, providing the necessary strength and durability to ensure long-term EMI/RFI suppression.
The Industrial Challenge: Why Standard Adhesives Fail EMI/RFI Shielding
EMI/RFI shielding materials, often thin metal foils, conductive elastomers, or plated plastics, are vital for protecting internal components from external noise and preventing system emissions. However, bonding these materials presents unique difficulties:
- Dissimilar Substrates: Bonding shielding materials requires adherence to a wide variety of substrates, including metals, engineered plastics, ceramics, and composites.
- Thermal Cycling: Industrial applications expose assemblies to extreme temperature fluctuations, causing expansion and contraction that can stress and crack weaker adhesive bonds.
- Harsh Environments: Exposure to solvents, cleaning agents, moisture, and operational fluids demands exceptional chemical resistance from the adhesive layer.
- Vibration and Peel Stress: Shielding components are often subjected to operational vibration and significant peel forces at the edges, requiring an adhesive with high toughness and peel strength.
A conventional adhesive will eventually fail under these combined stresses, compromising the shield and leading to system failure, compliance issues, or reduced signal integrity. The solution lies in a specialized, high-performance bonder.
Introducing Incure Epo-Weld™ UHB-100: The Next Generation Bonder
For industrial users seeking an adhesive engineered for the toughest bonding applications—specifically the reliable, long-term attachment of EMI/RFI shielding—the Incure Epo-Weld™ UHB-100 two-part, rubberized epoxy bonder sets a new industry standard.
Designed to overcome the limitations of standard adhesives, UHB-100 is a chemical-resistant, ultra-high lap shear/peel epoxy bonder that ensures the permanent fixation and durability required for mission-critical industrial electronics.
Unmatched Performance for Demanding Applications
The specifications of the Epo-Weld™ UHB-100 demonstrate its suitability for high-stress industrial use:
| Performance Metric | Epo-Weld™ UHB-100 Specification | Industrial Benefit for EMI/RFI |
| Tensile Shear Strength | 4,600 PSI (ASTM D1002-94) | Delivers a secure mechanical lock, resisting shear forces common in assembly and operation. |
| Flexural Strength | Up to 13,800 PSI(ASTM D790) | High rigidity and load-bearing capacity, preventing component deformation under stress. |
| Service Temperature Range | -53°C to 176°C(-65°F to 350°F) | Maintains structural integrity across extreme thermal cycles, vital for outdoor or high-heat enclosures. |
| Chemical Resistance | Excellent | Resistance to industrial solvents, acids, bases, salts, and organic fluids ensures the bond integrity is preserved in corrosive environments. |
| Formulation & Strength | Two-Part (10:1) Rubberized Epoxy | The rubberized chemistry provides exceptional peel strength and toughness, critical for bonding thin shielding materials and resisting fatigue from vibration. |
Technical Versatility and Application
The Incure Epo-Weld™ UHB-100 is specifically formulated for reliability. It is a low-viscosity system that flows easily, ensuring excellent wetting and bond formation on diverse substrates including metals, glass, and ceramics. This versatility makes it ideal for bonding EMI/RFI gaskets, metal enclosures, and conductive foils used in industrial PCs, communication equipment, and aerospace components.
Curing for Optimal Results
While the material bonds exceptionally, achieving its maximum performance requires adherence to the recommended cure schedule:
- First Cure: 2 hours @ 70°C (158°F)
- Followed By: 2 days @ 25°C (77°F)
This controlled cure ensures the rubberized matrix fully cross-links, delivering the ultra-high lap shear and peel strength necessary for reliable EMI/RFI suppression over the product’s entire lifecycle.
Conclusion: Securing Your Shielding, Securing Your System
In high-stakes industrial applications, the choice of adhesive is a critical design decision. The Incure Epo-Weld™ UHB-100 offers an optimal balance of ultra-high mechanical strength, flexibility, and exceptional chemical and thermal resistance.
By choosing this specialized epoxy bonder, industrial users can ensure that their EMI/RFI shielding is permanently and reliably bonded, safeguarding system performance and operational longevity, even in the most challenging conditions.
To learn more about integrating Epo-Weld™ UHB-100 into your electronic shielding design and manufacturing process, contact our technical team today for application support.