Electronics Adhesives

The FIPG and CIPG Solution for Fast-Paced Production: Incure Uni-Seal 6322

On a high-volume line, a sealing material that needs minutes of oven time or a long moisture cure becomes the bottleneck. Incure Uni-Seal 6322 is a light-curable form-in-place and cure-in-place gasket material designed to seal electronic and automotive housings at the pace of automated production. The Case for Light-Cured Gaskets Traditional gasketing forces a choice between slow-curing liquid sealants and the inventory and fit problems of die-cut parts. A UV, visible, or LED light-curable FIPG or CIPG material removes that trade-off. The bead is dispensed exactly where it is needed, then cured on demand in seconds as the part passes a lamp, so throughput is set by line speed rather than by chemistry. What Uni-Seal 6322 Offers Acid-free formulation that will not corrode copper, solder, or fine-pitch conductors Low viscosity for precise dispensing into narrow channels and around tight corners Fast cure with low-energy LED lamps, suited to inline and conveyorized processes High resilience and memory retention, so the gasket recovers after compression cycles better than many cut elastomers Air-tight sealing against moisture, dust, and pressure differentials Moisture, temperature, and chemical resistance for under-hood and outdoor service Dual use as a temporary mask during conformal coating Building the Process Around It Bead and groove design. Give the dispensed bead a defined cross-section and a target compression of roughly 20 to 40 percent when the housing closes. Consistent geometry is what makes the seal repeatable unit to unit. Dispensing. A positive-displacement dispense head keeps bead volume constant as the material warms or the reservoir drains. Programmed paths hold the bead centered on the flange through corners and changes in direction. Curing. Size the lamp to the largest part so the entire bead reaches full cure in one pass. For long or complex flange paths, an inline conveyor curing system or a correctly matched UV LED flood lamp keeps cure time in step with takt. A cured gasket and a metal or plastic housing expand at different rates, so a seal that is fine at room temperature can loosen in the cold or over-compress when hot. Weighing how thermal expansion mismatch stresses a sealed joint guides the choice between a firmer and a more compliant grade. For help matching Uni-Seal 6322 to a dispense cell and cure station, Email Us with your cycle-time targets and housing geometry. Production Benefits Switching to a light-cured poured gasket typically shortens cycle time, cuts gasket inventory and scrap, reduces rework by forming the seal in one controlled step, and gives engineering the freedom to revise flange geometry without new tooling. The same material can seal a control-unit housing on one line and mask a board for coating on another. Resilience and Compression Set A gasket's job is to keep sealing after it has been compressed, warmed, cooled, and vibrated for years. The property that describes this is compression set: how much permanent deformation remains after the load is removed. A material with high compression set gradually loses its sealing force and the joint starts to leak,…

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August 21, 2024
Electronics Adhesives

Choosing a UV-Curable Potting Compound for Electronics

Potting is supposed to be the last line of defense for an electronic assembly, but the wrong compound can crack a solder joint, cloud an optical window, or trap moisture against the copper it was meant to protect. Selecting a potting resin is a balance of optical clarity, cure speed, stress, and environmental resistance. What a Potting Compound Has to Do A potting compound fills the space around a circuit or component and hardens into a solid mass that seals out moisture and contamination, damps vibration, and holds parts in place. Because the resin touches every surface it surrounds, it has to do that without imposing damaging stress and without changing dimension as it cures or as temperature swings. Key Selection Criteria Viscosity: A low-viscosity resin flows into tight gaps and under fine-pitch components, reaching full coverage without trapped voids. Thicker grades stay put on vertical surfaces and in open cavities. Cure speed and method: UV and visible-light curable resins can set in as little as a minute under an appropriate lamp, which keeps work-in-process low. Shadowed regions under tall parts need a secondary heat or moisture cure path. Optical clarity: For assemblies with LEDs, sensors, or inspection requirements, a transparent resin keeps components visible and lets light pass without loss or color shift. Shrinkage and water absorption: Low linear shrinkage limits internal stress and warpage; low water absorption keeps dielectric properties stable in humid service. Chemical resistance: Grades resistant to mineral oils, fuels, and gases suit automotive and industrial environments. Substrate adhesion: Good bonding to metals, glass, and ceramics keeps the pot anchored to the housing. The Incure Uni-Seal line includes light-curable potting and sealing grades across this range, including higher-temperature options such as Uni-Seal 6213HT for chemically aggressive or hot service. Applying Potting Compound Correctly Start with clean substrates. Flux residue, oils, and mold release all interfere with wetting and adhesion, and ionic contamination left under the pot can drive electrochemical migration in humid conditions. Control the pour and the cure: Degas the resin, or vacuum-pot, to eliminate bubbles that concentrate stress and lower dielectric strength. For deep sections, cure in steps to keep the exotherm and shrinkage stress under control. Verify that light-curable resin in shadowed areas receives the secondary cure cycle. Check cured hardness against the datasheet before releasing parts, and pull periodic cross-sections to confirm void-free fill. Because the resin and the components expand at different rates, thermal cycling is the toughest test of a potting job. Reviewing how expansion mismatch causes cracking and delamination explains why a low-shrinkage, appropriately compliant resin outlasts a harder one in cycling service. When clarity is the priority, the same considerations that apply to transparent bonding adhesives apply to clear potting resins, and matching the resin to a correctly sized UV LED flood lamp ensures full through-cure. For help selecting a potting grade for your assembly and cure equipment, Email Us with your requirements. Clear Versus Filled Potting Resins An unfilled clear resin keeps components visible for inspection, lets…

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August 21, 2024
Electronics Adhesives

The FIPG and CIPG Sealing Solution for Electronics and Automotive: Incure Uni-Seal 3393

A poured-in-place gasket only works if it seals on the first try and stays sealed through vibration, temperature swings, and chemical exposure. Cut gaskets shift, compress unevenly, and leave gaps at corners. Incure Uni-Seal 3393 is a light-curable form-in-place and cure-in-place gasket material built to seal complex geometries in electronics and automotive assemblies. Form-in-Place and Cure-in-Place Basics A form-in-place gasket (FIPG) is dispensed as a bead directly onto one mating surface, then cured before assembly so it behaves like a precision-molded seal. A cure-in-place gasket (CIPG) follows the same idea but is compressed between surfaces during cure. Both approaches eliminate gasket inventory, adapt instantly to design changes, and follow irregular flange paths that a die-cut part cannot. Why Uni-Seal 3393 Uni-Seal 3393 cures under UV, visible, or LED light and is engineered around the needs of sensitive electronics: Acid-free chemistry that will not corrode copper, solder, or fine-pitch leads Low viscosity for precise dispensing and penetration into narrow channels Tack-free cure leaving a clean, handleable surface with no residue transfer Air-tight sealing against moisture, dust, and pressure differentials Ease-of-peel rework, so a module can be opened for repair and resealed Moisture, temperature, and chemical resistance for under-hood and outdoor service Dual use as a temporary mask during downstream conformal coating Designing a Reliable Poured Gasket Bead geometry drives the seal. Specify a groove or a defined land width so the dispensed bead has a consistent cross-section and a target compression, generally 20 to 40 percent, when the housing closes. Too little compression leaks; too much extrudes material and can bottom out the joint. Dispense control is the other half. A positive-displacement dispense head holds bead volume constant as the material warms or the reservoir empties, and programmed paths keep the bead centered on the flange around tight corners. After dispensing, the assembly passes under a lamp sized to the part so the entire bead reaches full cure. Because a cured gasket and a metal or plastic housing expand at different rates, a seal that is fine at room temperature can open up in the cold or over-compress when hot. Considering how thermal expansion mismatch stresses a bonded or sealed joint guides the choice between a firmer or a more compliant gasket. Matching the material to a suitable UV LED flood lamp or an inline conveyor system keeps cure time in step with line speed. For help fitting Uni-Seal 3393 to a flange design and dispense process, Email Us with your housing drawings. Poured Gaskets Versus the Alternatives Die-cut elastomer gaskets carry a hidden cost: tooling for each new shape, inventory for each part number, scrap from the cut, and assembly labor to place them without pinching or misaligning. They also seal poorly at tight radii and sharp corners, exactly where enclosures tend to leak. A poured gasket forms to the flange path automatically and needs no part-specific tooling. Room-temperature-vulcanizing (RTV) silicone beads solve the fit problem but cure slowly from the surface inward, so a thick bead can stay soft…

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August 21, 2024
Electronics Adhesives

Potting Compounds for Extreme Environments: Incure Uni-Seal 6213HT

Electronics that run hot, sit outdoors, or live inside a machine face a punishing mix of heat, moisture, vibration, and chemicals. A potting compound that passes a bench test can still crack or absorb water after a season in the field. Incure Uni-Seal 6213HT is built for assemblies that must keep working under those conditions. What Potting Does Potting fills the cavity around a circuit or component with a solid resin, creating a continuous barrier against the environment and a mechanical anchor against shock and vibration. Unlike a thin conformal coating, a potted section is fully encased, which raises protection but also puts the resin in intimate contact with every component. That makes two properties critical: low stress on the parts and stable behavior across temperature. Where Uni-Seal 6213HT Fits Uni-Seal 6213HT is a thick-viscosity adhesive that cures under UV, visible, or LED light, with heat as a secondary path for shadowed regions. The high viscosity keeps it in place on vertical walls and around tall components during application, and the multi-mode cure lets it set fully even where light cannot reach every surface. Key characteristics for demanding service: Deep single-pass potting to roughly 5 mm, forming a hard solid pot without repeated lifts Chemical resistance to mineral oils, fuels, gases, and common industrial solvents Low water absorption and low shrinkage, which limits dimensional change and internal stress over the service life Adhesion to metals, glass, and ceramics, so the pot stays bonded to the housing and substrate Smooth cured finish suitable for inspection and downstream handling Selecting and Applying a Potting Compound Match the resin to the environment. For high-temperature or chemically aggressive service, prioritize a low coefficient of thermal expansion, a glass transition temperature above the maximum operating temperature, and demonstrated resistance to the specific fluids present. For assemblies that dissipate significant heat, a thermally conductive grade moves that heat into the housing instead of trapping it. Process control determines whether those properties actually reach the finished part: Prepare surfaces. Clean off flux residue, oils, and mold release so the resin can wet and bond the substrate. Manage the exotherm. In deep or large-volume pots, cure in controlled steps so reaction heat does not spike and generate voids or shrinkage stress. Remove entrapped air. Vacuum degassing before or during pour prevents bubbles that concentrate stress and reduce dielectric performance. Cure completely. Confirm shadowed regions receive the secondary heat cycle, and verify hardness against the datasheet before releasing parts. Because the resin and the components expand at different rates, thermal cycling is where marginal potting jobs fail. Reviewing how expansion mismatch drives cracking and delamination helps explain why a compliant, low-shrinkage resin outlasts a harder, higher-stress one in cycling service. UV and visible-light potting resins also depend on adequate cure energy, so pairing the material with the right LED flood lamp for the curing area is part of the specification. For help evaluating Uni-Seal 6213HT against your temperature, chemical, and mechanical requirements, Email Us with your operating conditions. Thermal…

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August 21, 2024