Standard structural epoxies soften and lose strength well before 150°C, so a bracket or ceramic mount that runs hot needs a different chemistry entirely. Incure Epo-Weld™ UHTE-5320 is a two-part system formulated to hold structural strength at temperatures where ordinary epoxies fail. What UHTE-5320 is built for Epo-Weld™ UHTE-5320 is a two-component, ultra-high temperature epoxy for bonding, potting, and repair work in continuous high-heat service. It keeps useful tensile and flexural strength at temperatures that would turn a general-purpose epoxy rubbery, and it resists a wide range of process chemicals and fuels. It bonds well to metals and to technical ceramics such as alumina, which makes it a practical choice for sensor mounts, insulators, and high-temperature fixtures. The formulation is also compliant with NASA low-outgassing requirements, so it can be used in vacuum systems and space hardware without contaminating nearby optics or sensors. Key properties and why they matter Retained strength at temperature. The number that matters for a hot joint is not room-temperature shear strength but how much of that strength survives at the service temperature. UHTE-5320 is engineered to hold a large fraction of its strength through sustained heat exposure. Chemical resistance. The cured matrix stands up to solvents, fuels, and dilute acids and bases, which is essential in chemical-process and engine-adjacent equipment. Ceramic compatibility. Alumina and other technical ceramics are common in high-temperature assemblies. UHTE-5320 wets and bonds these surfaces when they are properly cleaned. Low outgassing. In vacuum service, volatile content from a curing adhesive can condense on cold surfaces. A low-outgassing grade avoids that problem. Where UHTE-5320 fits Aerospace and defense: bonding structural brackets, heat-shield hardware, and instrument mounts near propulsion and exhaust paths. Industrial furnaces and ovens: securing thermocouples, insulators, and fixtures inside heated enclosures. Electronics and semiconductor processing: potting and bonding components in deposition and annealing equipment. Oil, gas, and chemical processing: repairing and bonding equipment exposed to hot fluids and aggressive chemistry. Power generation: bonding sensor housings and support hardware on turbines, boilers, and heat exchangers. Bonding to ceramics and dissimilar materials The most common problem in a hot joint is not the adhesive itself but the stress created when two materials expand at different rates. A metal housing bonded to a ceramic insert loads the bond line every time the assembly heats or cools. Keep bond areas modest, control the bond line thickness, and design the joint to load the adhesive in shear rather than cleavage. This guide on how CTE mismatch causes adhesive bond failure covers the mechanism and the design responses in detail. Not sure whether a bonded joint or a mechanical fastener is the better answer for your part? Email Us with the temperature profile and the substrates. Surface preparation Metals: solvent degrease, abrade to fresh material, then a final solvent wipe and full dry. Ceramics: clean thoroughly and lightly abrade; remove all dust before bonding. Fired ceramics can hold absorbed moisture, so a short warm-up before bonding improves adhesion. Bond promptly after preparation and protect surfaces from…