Delicate solder joints and fine wires are the functional heart of any electronic device, yet they are often the most vulnerable points. They are subjected to continuous stress from vibration, mechanical shock, and, most critically, repeated thermal cycling—the expansion and contraction caused by heating up during operation and cooling down. Failure here can lead to intermittent signal loss, micro-fractures, and complete system failure.
Don’t let thermal stress compromise the reliability and lifespan of your electronics.
INCURE GapFill™ D98 Thermal Cycling Resistant Adhesive
Unlike standard rigid cyanoacrylates, the INCURE GapFill™ D98 is a modified formulation engineered to withstand the most demanding environments. It provides a robust, high-stress encapsulant that flexes with component movement, maintaining a perfect seal and mechanical anchor across a broad temperature range.
| Feature & Benefit | Technical Insight for Encapsulation | Conversion Value |
| Superior Thermal Cycling Resistance | Engineered with rubber modification to absorb stress from repeated heating and cooling (e.g., -40°C to +120°C). | End the Fatigue: Dramatically reduce failure rates caused by temperature fluctuations. |
| Toughened, High-Stress Bond | Provides an effective shock-absorbing layer, preventing mechanical shock and vibration from translating to the joint. | Lock in Reliability: Anchor wires and protect fragile joints from harsh operational conditions. |
| Excellent Adhesion to Substrates | Bonds well to common electronic materials, including plastics, metals, and insulating jackets. | Universal Protection: One product for securing and insulating diverse electronic components. |
| Gap-Filling Capability | Fills small voids around irregularly shaped solder joints or wire bundles, ensuring complete encapsulation. | Total Coverage: Achieve a complete, void-free protective barrier every time. |
Application Steps: Encapsulating for Permanent Integrity
Preparation (Cleanliness is Key): Use an electronic-safe solvent (like IPA) to clean the solder joint or wire area, removing any flux residue, oil, or dust. The surface must be perfectly dry.
Application: Apply a small bead of GapFill™ D98 directly over the solder joint or wire exit point, ensuring the material flows to encapsulate the critical stress-prone area.
Curing: Allow the adhesive to cure fully. This instant adhesive typically provides handling strength in seconds, but allow the full 24-hour cure for maximum chemical and thermal cycling resistance before system deployment.
Stop risking electronic failure and maximize your product’s lifespan.