1.0INCURE INC.https://incurelab.com/wpTechhttps://incurelab.com/wp/author/techrich600338<blockquote class="wp-embedded-content" data-secret="3F4Fw038Ob"><a href="https://incurelab.com/wp/bubble-entrapment-in-heat-cured-adhesives">Bubble Entrapment in Heat-Cured Adhesives</a></blockquote><iframe sandbox="allow-scripts" security="restricted" src="https://incurelab.com/wp/bubble-entrapment-in-heat-cured-adhesives/embed#?secret=3F4Fw038Ob" width="600" height="338" title="“Bubble Entrapment in Heat-Cured Adhesives” — INCURE INC." data-secret="3F4Fw038Ob" frameborder="0" marginwidth="0" marginheight="0" scrolling="no" class="wp-embedded-content"></iframe><script> /*! This file is auto-generated */ !function(d,l){"use strict";l.querySelector&&d.addEventListener&&"undefined"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!/[^a-zA-Z0-9]/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret="'+t.secret+'"]'),o=l.querySelectorAll('blockquote[data-secret="'+t.secret+'"]'),c=new RegExp("^https?:$","i"),i=0;i<o.length;i++)o[i].style.display="none";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute("style"),"height"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):"link"===t.message&&(r=new URL(s.getAttribute("src")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener("message",d.wp.receiveEmbedMessage,!1),l.addEventListener("DOMContentLoaded",function(){for(var e,t,s=l.querySelectorAll("iframe.wp-embedded-content"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute("data-secret"))||(t=Math.random().toString(36).substring(2,12),e.src+="#?secret="+t,e.setAttribute("data-secret",t)),e.contentWindow.postMessage({message:"ready",secret:t},"*")},!1)))}(window,document); //# sourceURL=https://incurelab.com/wp/wp-includes/js/wp-embed.min.js </script> Bubbles in heat-cured adhesives are voids that form specifically during the thermal cure process — distinguished from voids trapped during assembly by their formation mechanism and their characteristic distribution within the bondline. Understanding how heat causes bubble formation, and how to prevent it, is essential for producing void-free bonds in applications that require thermal curing. […]