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</html><description>A. Dispensing Issues The method of applying the adhesive is the most frequent source of air entrapment. B. Substrate Issues Air can be introduced from the components being bonded. C. Chemical Reaction (Outgassing) In rare cases, the adhesive itself can generate gas. 2. Solutions for Eliminating Voids A. Pre-Process (Adhesive Handling) B. Dispensing and Mating [&hellip;]</description></oembed>
