{"version":"1.0","provider_name":"INCURE INC.","provider_url":"https:\/\/incurelab.com\/wp","author_name":"Incure Content Team","author_url":"https:\/\/incurelab.com\/wp\/author\/kimleelcy","title":"Improving Adhesion Strength in Semiconductor Packaging - INCURE INC.","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"6ILJZ6ZAfl\"><a href=\"https:\/\/incurelab.com\/wp\/improving-adhesion-strength-in-semiconductor-packaging\">Improving Adhesion Strength in Semiconductor Packaging<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/incurelab.com\/wp\/improving-adhesion-strength-in-semiconductor-packaging\/embed#?secret=6ILJZ6ZAfl\" width=\"600\" height=\"338\" title=\"&#8220;Improving Adhesion Strength in Semiconductor Packaging&#8221; &#8212; INCURE INC.\" data-secret=\"6ILJZ6ZAfl\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script>\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/\/# sourceURL=https:\/\/incurelab.com\/wp\/wp-includes\/js\/wp-embed.min.js\n<\/script>\n","description":"A die-attach bond that passes initial pull testing at 25\u00b0C can still fail in the field after a few hundred thermal cycles \u2014 adhesion strength in semiconductor packaging has to be engineered for the worst environment the part will see, not the easiest one to test in. Adhesion Strength Is a System Property, Not a [&hellip;]"}