{"version":"1.0","provider_name":"INCURE INC.","provider_url":"https:\/\/incurelab.com\/wp","author_name":"Incure Content Team","author_url":"https:\/\/incurelab.com\/wp\/author\/kimleelcy","title":"Improving Bond Strength in MEMS Sensor Packaging - INCURE INC.","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"EH6aBEydAI\"><a href=\"https:\/\/incurelab.com\/wp\/improving-bond-strength-in-mems-sensor-packaging\">Improving Bond Strength in MEMS Sensor Packaging<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/incurelab.com\/wp\/improving-bond-strength-in-mems-sensor-packaging\/embed#?secret=EH6aBEydAI\" width=\"600\" height=\"338\" title=\"&#8220;Improving Bond Strength in MEMS Sensor Packaging&#8221; &#8212; INCURE INC.\" data-secret=\"EH6aBEydAI\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script>\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/\/# sourceURL=https:\/\/incurelab.com\/wp\/wp-includes\/js\/wp-embed.min.js\n<\/script>\n","description":"Micro-Electro-Mechanical Systems have transformed consumer electronics, automotive safety, and aerospace instrumentation, and as these devices keep shrinking while growing more complex, the packaging bond holding them together has become the single point of failure engineers worry about most. What the Bond Actually Has to Do MEMS packaging performs several jobs at once: mechanical support for [&hellip;]"}