{"version":"1.0","provider_name":"INCURE INC.","provider_url":"https:\/\/incurelab.com\/wp","author_name":"admin","author_url":"https:\/\/incurelab.com\/wp\/author\/admin","title":"Selecting a Die-Attach Epoxy for Thermal Management - INCURE INC.","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"GtKGejutnZ\"><a href=\"https:\/\/incurelab.com\/wp\/selecting-the-optimal-die-attach-epoxy\">Selecting a Die-Attach Epoxy for Thermal Management<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/incurelab.com\/wp\/selecting-the-optimal-die-attach-epoxy\/embed#?secret=GtKGejutnZ\" width=\"600\" height=\"338\" title=\"&#8220;Selecting a Die-Attach Epoxy for Thermal Management&#8221; &#8212; INCURE INC.\" data-secret=\"GtKGejutnZ\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script>\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/\/# sourceURL=https:\/\/incurelab.com\/wp\/wp-includes\/js\/wp-embed.min.js\n<\/script>\n","description":"Junction temperature drives semiconductor lifespan more than almost any other single variable, and for many high-power dies the die-attach layer \u2014 not the package or the heat sink \u2014 is the largest single contributor to thermal resistance between the chip and the outside world. The Unique Demands of Die-Attach Applications Die attach involves adhesively bonding [&hellip;]"}