Incure Pyra-Sil™ UV Silicone — Matching Grade to Cure Path and Substrate
A UV-cure adhesive fixes instantly wherever light reaches it and does nothing wherever it doesn't — which is exactly why a dual-cure silicone that finishes shadowed areas by moisture exposure solves a real problem on any assembly with a housing, an overlap, or a connector blocking the light path. Incure's Pyra-Sil™ UV silicone line covers that dual-cure need across four grades, plus one grade that breaks from the UV-cure pattern entirely. 901 and 904 Are a Viscosity-Matched Pair for General-Purpose Bonding Pyra-Sil™ 901 and 904 are both one-part, UV/moisture dual-cure, high-temperature silicones formulated for bonding a wide range of substrates as form-in-place gaskets, conformal coatings, and sealants — UV light fixes exposed surfaces fast, while ordinary moisture in the air fully cures whatever the light couldn't reach within 72 hours. The two share the same -45°C to 260°C service range and dual-cure chemistry, differing mainly in viscosity and hardness: 901 runs thicker at 6,500–8,500 cP and cures to Shore A30–A40, while 904 is noticeably thinner at 2,000–3,000 cP and softer at Shore A20–A30. That gives a line running general-purpose bonding and sealing work a genuine choice between a heavier-bodied grade that holds its shape on a gap or seam and a thinner one that flows more readily into finer features, without giving up dual-cure convenience either way. Both are compatible with manual dispensing and automated or spray equipment, so the viscosity choice is driven by the joint geometry itself rather than by what equipment the line already runs. 905 and 909 Add High-Altitude Arcing Protection on PCBA, at a Softer Hardness Scale Pyra-Sil™ 905 and 909 are also a matched dual-cure pair, but they're built specifically as a conformal coating for PCB assemblies, protecting against moisture, ozone, and — notably — high-altitude arcing, a failure mode specific to circuit boards operating at reduced atmospheric pressure where dielectric breakdown happens more readily than at sea level. Both cure on the O-scale rather than the A-scale used by 901 and 904 — 905 and 909 both land at O65–O95, a softer, more gel-like hardness measurement suited to a thin conformal coating rather than a structural gasket material. The two differ mainly in viscosity: 905 is the thinnest grade in the entire line at 350–750 cP, suited to spray or dip coating over populated boards, while 909 runs thicker at 2,500–3,500 cP for more controlled bead or brush application. Both fix under UV light in seconds and fully cure shadowed areas by moisture within 72 hours, the same dual-cure logic as 901 and 904 but tuned specifically for board-level electronics protection. The arcing-protection framing is worth taking seriously as a real selection factor rather than boilerplate marketing language — a board that never leaves sea level doesn't need it, but one destined for aerospace, high-altitude telecom, or any enclosure that depressurizes in service does, and the general-purpose 901/904 pair doesn't make the same claim. Email Us with your substrate, service temperature, and whether the assembly has shadowed areas UV light can't reach, and…