Epoxy

Incure Epo-Weld™ UHB-100: Ultra High Bond Epoxy Adhesive

Most structural epoxies are strong in shear and fragile in peel, so they crack at the edges when a joint flexes. Incure Epo-Weld™ UHB-100 is a rubber-toughened two-part epoxy built to hold high strength while still tolerating impact and vibration. What UHB-100 is Epo-Weld™ UHB-100 is the unfilled, rubber-modified grade in the Ultra High Bond family. The elastomer phase dispersed through the cured epoxy blunts crack growth, so the adhesive keeps working after an impact that would shatter a rigid bond line. Compared with the ceramic-filled UHB-200, UHB-100 has a lower viscosity, which lets it wet out tight joints and penetrate slightly porous surfaces before it gels. Typical service temperature runs from about -53°C to 176°C (-55°F to 350°F). The cured adhesive resists a wide range of solvents, fuels, and dilute acids and bases, and it bonds effectively to metals, glass, and ceramics. Key properties and what they mean for the joint High lap shear and peel strength. Peel resistance is what keeps a bond from unzipping at the edge when the assembly twists. UHB-100 provides both, which is unusual for an epoxy at this strength level. Low viscosity. Easier wet-out means fewer voids and more real contact area. It also makes UHB-100 practical for thin bond lines and for filling small gaps by capillary action. Wide temperature range. When you bond dissimilar materials, every temperature change loads the joint because the two substrates expand at different rates. A toughened bond line absorbs that movement. The mechanism is explained in this guide to how CTE mismatch causes adhesive bond failure. Chemical resistance. The cured matrix holds up to cleaning agents, coolants, and hydraulic fluids over long exposure. Where UHB-100 fits Aerospace and defense: brackets, standoffs, and sensor housings exposed to vibration and thermal cycling. Automotive and transportation: bonding trim, sensors, and structural inserts where road input would fatigue a brittle adhesive. Electronics and semiconductor equipment: securing subassemblies that must survive shipping and handling shock. Industrial equipment and machinery: attaching wear plates, covers, and instrument mounts on vibrating equipment. Renewable energy hardware: bonding enclosure components and mounting hardware in wind and solar installations subject to wind loading and daily thermal swings. Joint design and bond line control Aim for a bond line of roughly 0.1 to 0.25 mm. Too thin and the joint is starved and stress-concentrated; too thick and shear strength drops while thermal stress rises. Design the joint so the adhesive carries load in shear or compression rather than peel or cleavage, and include a mechanical locating feature so the bond is not the only thing resisting motion. On large flat overlaps, small glass-bead spacers help hold a consistent gap. If you want a second opinion on a joint before committing to production, Email Us with your substrates, load case, and environment. Surface preparation Steel and stainless: solvent degrease, abrade to bright metal, then a final solvent wipe and full dry. Aluminum: degrease and abrade, or use a chemical etch or conversion coating for the most durable bond, since…

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August 12, 2024
Epoxy

Ultra-High Temperature Epoxy: Incure Epo-Weld™ UHTE-5322

A high-temperature adhesive is only useful on the production floor if you can actually apply it. Incure Epo-Weld™ UHTE-5322 pairs a wide service range with a room-temperature cure, so shops without an oven can still bond and pot parts that will run hot. What sets UHTE-5322 apart Epo-Weld™ UHTE-5322 is a two-part epoxy that holds performance across a range of roughly -60°C to 300°C (-76°F to 572°F) and works for both bonding and potting. Its defining feature within the Ultra High Temperature family is that it cures at ambient temperature. Most epoxies rated for this kind of heat need an oven cure to reach full properties; UHTE-5322 reaches a usable cure on the bench, which simplifies the process for repair work, large assemblies that will not fit in an oven, and heat-sensitive components nearby. The cured system resists a wide set of solvents, fuels, and dilute acids and bases, and it develops strong tensile and flexural strength. Key properties and what they mean Wide thermal range. The same grade covers cold-soak conditions and sustained heat, which matters for equipment that cycles between the two, such as transport hardware and outdoor industrial installations. Room-temperature cure. No oven means lower energy cost, no fixture bake-out, and no risk of thermally damaging adjacent parts. An optional mild heat cure still speeds the schedule and lifts the final glass transition temperature if you want it. Bonding and potting in one product. You can use a single qualified material for both structural joints and encapsulation, which cuts down on inventory and qualification work. Chemical resistance. The matrix holds up to cleaning chemistry and process fluids over long exposure. Where UHTE-5322 fits Aerospace and defense: potting connectors and bonding brackets on assemblies too large or heat-sensitive for an oven cure. Automotive and transportation: encapsulating sensors and bonding hardware in engine-bay and exhaust-adjacent locations. Electronics in hot environments: potting power components and control modules that run near their thermal limits. Industrial ovens and dryers: bonding instrumentation and support hardware during on-site maintenance. Rail and transit systems: field repairs on traction and braking equipment where an oven is not available. Bonding and potting practice For potting, pour in thin passes and let each pass release trapped air before adding more; a deep single pour tends to hold voids and can exotherm if the mass is large. For bonding, control the bond line to roughly 0.1 to 0.25 mm and design the joint for shear loading. When you bond or pot around ceramics, glass, or dissimilar metals, plan for thermal expansion differences; the stress that builds at every temperature change is a leading cause of bond-line cracking, as explained in this guide to how CTE mismatch causes adhesive bond failure. If you are potting a module and are not sure how the exotherm will behave in your pour volume, Email Us with the cavity dimensions and fill depth. Surface preparation Degrease every substrate with a clean solvent, abrade metals to expose fresh material, then wipe again and let the…

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August 12, 2024
Epoxy

Ultra-High Temperature Resistant Epoxy Resin: Incure Epo-Weld™ UHTE-5320

Standard structural epoxies soften and lose strength well before 150°C, so a bracket or ceramic mount that runs hot needs a different chemistry entirely. Incure Epo-Weld™ UHTE-5320 is a two-part system formulated to hold structural strength at temperatures where ordinary epoxies fail. What UHTE-5320 is built for Epo-Weld™ UHTE-5320 is a two-component, ultra-high temperature epoxy for bonding, potting, and repair work in continuous high-heat service. It keeps useful tensile and flexural strength at temperatures that would turn a general-purpose epoxy rubbery, and it resists a wide range of process chemicals and fuels. It bonds well to metals and to technical ceramics such as alumina, which makes it a practical choice for sensor mounts, insulators, and high-temperature fixtures. The formulation is also compliant with NASA low-outgassing requirements, so it can be used in vacuum systems and space hardware without contaminating nearby optics or sensors. Key properties and why they matter Retained strength at temperature. The number that matters for a hot joint is not room-temperature shear strength but how much of that strength survives at the service temperature. UHTE-5320 is engineered to hold a large fraction of its strength through sustained heat exposure. Chemical resistance. The cured matrix stands up to solvents, fuels, and dilute acids and bases, which is essential in chemical-process and engine-adjacent equipment. Ceramic compatibility. Alumina and other technical ceramics are common in high-temperature assemblies. UHTE-5320 wets and bonds these surfaces when they are properly cleaned. Low outgassing. In vacuum service, volatile content from a curing adhesive can condense on cold surfaces. A low-outgassing grade avoids that problem. Where UHTE-5320 fits Aerospace and defense: bonding structural brackets, heat-shield hardware, and instrument mounts near propulsion and exhaust paths. Industrial furnaces and ovens: securing thermocouples, insulators, and fixtures inside heated enclosures. Electronics and semiconductor processing: potting and bonding components in deposition and annealing equipment. Oil, gas, and chemical processing: repairing and bonding equipment exposed to hot fluids and aggressive chemistry. Power generation: bonding sensor housings and support hardware on turbines, boilers, and heat exchangers. Bonding to ceramics and dissimilar materials The most common problem in a hot joint is not the adhesive itself but the stress created when two materials expand at different rates. A metal housing bonded to a ceramic insert loads the bond line every time the assembly heats or cools. Keep bond areas modest, control the bond line thickness, and design the joint to load the adhesive in shear rather than cleavage. This guide on how CTE mismatch causes adhesive bond failure covers the mechanism and the design responses in detail. Not sure whether a bonded joint or a mechanical fastener is the better answer for your part? Email Us with the temperature profile and the substrates. Surface preparation Metals: solvent degrease, abrade to fresh material, then a final solvent wipe and full dry. Ceramics: clean thoroughly and lightly abrade; remove all dust before bonding. Fired ceramics can hold absorbed moisture, so a short warm-up before bonding improves adhesion. Bond promptly after preparation and protect surfaces from…

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August 12, 2024
Epoxy

Incure Epo-Weld™ UHB-200: High Tensile Strength Epoxy Adhesive

When a bonded joint has to survive drop shock, sustained vibration, and wide temperature swings without cracking at the bond line, a rigid structural epoxy is often the wrong tool. Incure Epo-Weld™ UHB-200 is built for exactly that gap. What UHB-200 is designed to do Epo-Weld™ UHB-200 is a two-part, rubber-modified structural epoxy in the Ultra High Bond family. The rubber phase toughens the cured matrix so the adhesive absorbs impact energy and damps vibration instead of transferring the full load into brittle substrates such as glass and ceramic. The result is a joint that keeps high lap shear strength while also delivering meaningful peel strength, which unmodified epoxies rarely provide. The adhesive maintains performance across a service range of roughly -53°C to 162°C (-55°F to 325°F) and resists a broad set of solvents, fuels, and dilute acids and bases. It bonds well to metals, glass, and technical ceramics such as alumina, making it a practical choice where dissimilar materials meet. Key properties and why they matter Combined shear and peel strength. A joint that is strong in shear but weak in peel fails at the edges when it flexes. The toughened chemistry in UHB-200 raises peel resistance so the bond line tolerates edge loading and prying. Shock and vibration absorption. The cured adhesive has enough elongation to move with the assembly, reducing fatigue cracking in components exposed to repetitive vibration. Wide thermal range. Coefficient of thermal expansion (CTE) differences between a metal housing and a ceramic or glass insert generate shear stress at every temperature change. A slightly compliant bond line spreads that stress instead of concentrating it. For background on this failure mechanism, see how CTE mismatch causes adhesive bond failure. Chemical resistance. Cured UHB-200 holds up to cleaning solvents, hydraulic fluids, and process chemistry that would soften weaker adhesives. Where UHB-200 fits Aerospace and defense: bonding sensor mounts, antenna elements, and structural brackets that see launch vibration and thermal cycling. Automotive and transportation: attaching glass and ceramic elements to metal frames where road vibration would fatigue a rigid bond. Electronics and semiconductor equipment: securing components and subassemblies that must survive handling shock during transport and installation. Industrial machinery: bonding wear parts, guards, and instrumentation housings on equipment that runs with continuous mechanical excitation. Scientific and test instrumentation: mounting optical and ceramic elements in analytical equipment where alignment must hold through temperature drift. Getting the joint design right UHB-200 performs best in a controlled bond line, typically 0.1 to 0.25 mm. A starved joint concentrates stress; an over-thick joint reduces shear strength and increases the effect of CTE mismatch. Where possible, design the joint to load the adhesive in shear or compression rather than peel or cleavage, and add a mechanical feature such as a shoulder or pin so the adhesive is not the only thing resisting movement. Have a joint geometry you are unsure about? Email Us with the substrate pair, the load case, and the temperature range, and we can point you to the right grade.…

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August 12, 2024