High Temperature Potting Compounds — Epo-Weld™
Thermally stable potting compound for encapsulating and protecting electronic assemblies, sensors, and coils in high-temperature environments — complete encapsulation with reliable electrical insulation.
Technical Specifications
Alumina, silicon carbide, zirconium oxide, fused silica, and thermally conductive epoxy formulations
for high-temperature electronic potting, ceramic tooling, and encapsulation applications.
Built for High-Temperature Electronics
Epo-Weld™ HTP is specified for potting and encapsulating sensitive electronics and
electrical components in assemblies subject to continuous high operating temperatures.
Frequently Asked Questions
Common questions about Epo-Weld™ HTP high temperature potting compounds.
-
Potting compounds encapsulate electronic assemblies in a solid or semi-rigid polymer matrix to protect against moisture, vibration, thermal cycling, and chemical exposure. The compound fills all voids around components, preventing condensation ingress, eliminating vibration-induced fatigue failures, and providing electrical insulation across the assembly.
-
Epo-Weld™ HTP formulations are engineered for high-temperature service environments. Specific maximum service temperatures vary by grade. Contact our technical team with your operating temperature profile and we will identify the appropriate HTP grade for your application.
-
Epoxy potting compounds in the Epo-Weld™ HTP range are formulated for low volumetric shrinkage on cure. Low shrinkage is critical for protecting sensitive components — excessive shrinkage can induce stress cracking in encapsulated parts or delamination from housing walls. Our team can provide shrinkage data specific to the grade you select.
-
Yes. Epo-Weld™ HTP compounds provide reliable electrical insulation for potted assemblies including coils, transformers, motor stators, and power supplies. Volume resistivity and dielectric strength data are available for each grade. Thermally conductive HTP grades are also available for applications where heat dissipation is a priority alongside insulation.
-
Epo-Weld™ HTP is used for potting and encapsulating electronic assemblies, sensors, transformers, motor stators, ignition coils, connectors, and power supply modules. It is also suitable for ceramic tooling and refractory encapsulation where high-temperature performance is required alongside electrical insulation.
-
Contact our team at support@uv-incure.com with your application temperature range, component type, required electrical insulation class, and quantity. We will match you to the appropriate HTP grade and provide a technical data sheet and pricing.