High Temperature Inorganic Binders — Epo-Weld™
Water-based, single-component inorganic binders for formulating high-temperature adhesives, coatings, and refractory systems — rated to 3,000°F for furnace, kiln, aerospace, and precision ceramics applications where organic binders burn off.
Technical Specifications
Built for Extreme-Temperature Industrial Use
Epo-Weld™ HTIB inorganic binders are specified across refractory, ceramics,
aerospace, and investment casting wherever organic binders cannot survive the heat.
Frequently Asked Questions
Common questions about Incure Epo-Weld™ HTIB high temperature inorganic binders.
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A high temperature inorganic binder is a water-based, non-flammable binding agent made from inorganic silicate chemistry. Unlike organic epoxy or acrylic adhesives that decompose above 300–400°C, inorganic binders retain their bonding and structural integrity at temperatures up to 3,000°F (1,649°C) — making them suitable for refractories, ceramics, high-temperature coatings, and applications that exceed the limits of any organic adhesive.
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Epo-Weld™ HTIB grades are rated to 3,000°F (1,649°C) — far exceeding the capability of any organic adhesive or epoxy. This makes HTIB suitable for kiln furniture, furnace linings, refractory cements, and high-temperature coatings in industrial and aerospace environments.
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Epo-Weld™ HTIB uses water as the carrier medium, making it non-flammable and free of volatile organic compounds (VOCs). This reduces health and safety risks during application, simplifies storage, and makes it suitable for facilities with strict flammability and VOC emission controls.
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Epo-Weld™ HTIB is used for manufacturing refractory coatings and cements, bonding kiln furniture and ceramic components, formulating high-temperature adhesives for furnace linings, impregnating woven fibre and ceramic composites, and producing high-alkalinity ceramic dispersants. It is also used in aerospace for thermal protection coatings.
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Epo-Weld™ HTIB grades range from 10 cPs (ultra-low viscosity impregnating grades) to 4,000 cPs (high-viscosity gap-filling pastes). Both liquid and powder forms are available to match specific formulation and application requirements.
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Organic epoxy adhesives — including high-temperature grades — typically decompose and lose strength above 300–400°C. Epo-Weld™ HTIB retains its bonding capability to 3,000°F because its silicate-based chemistry does not combust or decompose at temperatures that destroy organic polymers. For any application above 300°C, inorganic binders are the only viable adhesive class.
