What does thermally conductive epoxy do differently from standard epoxy?

Standard epoxy adhesives are thermal insulators. Thermally conductive epoxy contains aluminium, aluminium nitride, or other thermally conductive fillers that create a heat transfer path through the bond line — dissipating heat from power components to heat sinks or thermal substrates. This prevents overheating and improves system reliability in power electronics.

What applications use Epo-Weld™ TC?

Epo-Weld™ TC is used for bonding heat sinks to power modules, mounting LEDs and power transistors, thermal interface bonding in power supplies, fabricating thermal probes, and any application where a structural bond must also transfer heat. It replaces thermal grease in applications where the bond line must also provide mechanical strength.

Is Epo-Weld™ TC electrically conductive?

No. Epo-Weld™ TC aluminium-filled grades are thermally conductive but electrically insulating. This makes them suitable for bonding heat sinks directly to component packages without risk of electrical short-circuit. If both thermal and electrical conductivity are required, contact Incure for silver-filled conductive adhesive options.

Does Epo-Weld™ TC meet NASA outgassing requirements?

Yes. All Epo-Weld™ TC grades meet NASA outgassing requirements (ASTM E595), making them suitable for aerospace, satellite, and vacuum environment thermal bonding applications.

What is the cure schedule for Epo-Weld™ TC?

Epo-Weld™ TC grades cure at room temperature or with accelerated heat cure. TC-9033 cures at room temperature; TC-9042 offers room temperature cure with elevated temperature options for higher performance. Refer to the product data sheet for specific cure schedules and post-cure requirements.

What substrates does Epo-Weld™ TC bond?

Epo-Weld™ TC bonds aluminium, copper, steel, ceramic substrates, and common engineering plastics used in power electronics and thermal management assemblies. Surfaces should be clean and degreased for maximum thermal and mechanical bond performance.

Thermally Conductive Epoxy Adhesives — Epo-Weld™

Thermally conductive epoxy adhesives that move heat off the part — high-temperature aluminum-filled grades for efficient heat dissipation in power electronics, plus an aluminum-nitride-filled electrically insulating grade for precision sensors and high-voltage potting. All grades meet NASA outgassing requirements.

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Prevents Overheating in Power Electronics

Aluminum-filled TC-9033 and TC-9042 replace non-conductive adhesives to create efficient thermal pathways between bonded components — preventing overheating and mechanical failure in power electronics assemblies.

NASA Outgassing Compliant

All TC grades meet NASA outgassing requirements — qualified for use in vacuum, space, and cleanroom environments where contamination control is critical.

Conductive & Insulating Grades

Choose aluminum-filled grades for maximum thermal conductivity, or aluminum nitride-filled TC-9051 for applications requiring both thermal performance and high dielectric strength — ideal for sensors and high-voltage components.

Product Range

Technical Specifications

Applications

Built for Thermal Management Assemblies

Epo-Weld™ TC adhesives are specified wherever heat transfer, electrical reliability,
and bond integrity must be maintained under continuous thermal cycling and mechanical stress.

Macro view of extruded aluminum heat sink fins for Epo-Weld™ TC thermally conductive epoxy power electronics bonding

Power Electronics & Heat Sinks

Bond heat sinks, power modules, Peltier devices, and LED arrays with aluminum-filled TC-9033 — high bond strength and thermal conductivity prevent overheating and mechanical failure in power electronics.

Automotive Electronics

Secure automotive ECUs, IGBTs, and battery pack thermal interfaces with TC-9033 or TC-9042 — robust resistance to thermal cycling, chemical exposure, and vibration across automotive operating ranges.

Close-up of electronic components on circuit board for Epo-Weld™ TC thermally conductive epoxy production thermal

Production Thermal Interface Bonding

Bond thermal interface assemblies at scale with TC-9042 — a high-viscosity paste with ultra-high temperature capability, low shrinkage, and consistent thermal transfer for manufacturing throughput.

Blue and white digital temperature measurement device for Epo-Weld™ TC thermally conductive epoxy temperature sensor

Temperature Sensors & Power Transistors

Bond temperature sensors and high-power transistors with aluminum nitride-filled TC-9051 — rapid thermal response and precise measurement with full electrical isolation between component and substrate.

White electric power generator unit for Epo-Weld™ TC thermally conductive epoxy high-voltage potting and insulation

High-Voltage Potting & Insulation

Pot and insulate high-voltage transformers, power insulators, capacitors, and laser tubes with TC-9051 — high dielectric strength prevents breakdown under sustained electrical stress.

Industrial complex emitting steam on snowy day for Epo-Weld™ TC thermally conductive epoxy cryogenic and aerospace

Cryogenic & Aerospace Components

Bond heat sinks and cryogenic components in aerospace assemblies with TC-9033 — stable adhesion and thermal conductivity across extreme temperature excursions with proven NASA outgassing compliance.

FAQ

Frequently Asked Questions

Common questions about Incure Epo-Weld™ TC thermally conductive epoxy adhesives.

Standard epoxy adhesives are thermal insulators. Thermally conductive epoxy contains aluminium or aluminium nitride fillers that create a heat transfer path through the bond line — dissipating heat from power components to heat sinks. This prevents overheating and improves system reliability in power electronics.
Epo-Weld™ TC is used for bonding heat sinks to power modules, mounting LEDs and power transistors, thermal interface bonding in power supplies, and fabricating thermal probes. It replaces thermal grease in applications where the bond line must also provide mechanical strength.
No. Epo-Weld™ TC aluminium-filled grades are thermally conductive but electrically insulating. This makes them suitable for bonding heat sinks directly to component packages without risk of short-circuit. Contact Incure for silver-filled grades if both thermal and electrical conductivity are required.
Yes. All Epo-Weld™ TC grades meet NASA outgassing requirements (ASTM E595), making them suitable for aerospace, satellite, and vacuum environment thermal bonding applications.
Epo-Weld™ TC grades cure at room temperature or with accelerated heat cure. Room temperature cure delivers adequate performance for most thermal management applications; elevated temperature cure improves bond strength and thermal transfer. Refer to the product data sheet for specific schedules.
Epo-Weld™ TC bonds aluminium, copper, steel, ceramic substrates, and engineering plastics used in power electronics and thermal management assemblies. Surfaces should be clean and degreased for maximum thermal and mechanical bond performance.

Thermally Conductive Epoxy Adhesives — Epo-Weld™

Technical Specifications

Built for Thermal Management Assemblies

Frequently Asked Questions

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